NXP i.MX RT700 features up to five computing cores designed to power smart AI-enabled edge devices such as wearables, consumer medical, smart home and HMI devices. Its Compute Subsystem includes a primary Arm^® Cortex^®-M33 running at 325 MHz and Cadence^® Tensilica^® HiFi 4 DSP for more DSP and audio processing. An ultra-low power Sense Subsystem includes a second Arm Cortex-M33 and Cadence Tensilica HiFi 1 DSP. This removes the need for an external sensor hub reducing system design complexity, footprint and BOM costs. i.MX RT700 includes NXP's eIQ^® Neutron NPU accelerating AI workloads by up to 172x and integrates up to 7.5 MB of onboard SRAM.