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The IW610 Family features a 1x1 Dual-band (2.4 GHz / 5 GHz) Wi-Fi 6 radio subsystem, offering improved network efficiency, reduced latency and extended range compared to previous Wi-Fi standards. Its Bluetooth LE radio supports a high-speed data rate of 2 Mbit/s, along with long-range communication and extended advertising for network commissioning and sensor aggregation. The IW610 Family supports both dual and single-antenna configurations, ensuring efficient coexistence between internal and external radios.
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The ADRV9002 is a high performance, highly linear, high dynamic range transceiver designed for performance vs. power consumption system optimization. The device is configurable and ideally suited to demanding, low power, portable and battery powered equipment. The ADRV9002 operates from 30 MHz to 6000 MHz and covers the UHF, VHF, industrial, scientific, and medical (ISM) bands, and cellular frequency bands in narrow-band (kHz) and wideband operation up to 40 MHz. The ADRV9002 is capable of both TDD and FDD operation.
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A6133M4 is a high performance and low cost 5.8GHz SoC. It integrates M4F micro controller, 512KBytes flash memory, 80KBytes SRAM, USB 2.0 compatible controller and various powerful functions.
A6133M4 supports fast PLL settling time for frequency hopping system. For packet handling, A6133M4 has built-in separated 1K Bytes TX/RX FIFO for data buffering and burst transmission, auto-ack and auto-resend, CRC for error packet filtering, FEC (7,4 hamming code) for 1-bit data correction per code word, RSSI for clear channel assessment, thermal sensor to monitor relative temperature, data whitening for data encryption / decryption. In addition, A6133M4 has built-in AES128 co-processor (Advanced Encryption Standard) for advanced data encryption or decryption which consists of the transformation of a 128-bit block into an encrypted 128-bit block. Those functions are very easy to use while developing a wireless system.
All features are integrated in a QFN7x7 56 pins package.
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nRF54L15 wireless SoC integrates an ultra-low-power multiprotocol 2.4 GHz radio and MCU (Microcontroller Unit) functionality, featuring a 128 MHz Arm Cortex-M33 processor and comprehensive peripheral set. The series offers a selection of packages and memory size options with pin-to-pin compatible QFN packages.
nRF54L15 is suitable for products using Bluetooth Low Energy, Bluetooth Mesh, Zigbee, Thread, Matter, Amazon Sidewalk, and proprietary 2.4 GHz protocols. In addition, it can run a Wi-Fi stack for the nRF70 Series companion ICs.
nRF54L15 is the largest memory option in the nRF54L Series, with 1.5 MB NVM and 256 KB RAM, for more demanding applications, while still being cost-optimized for high-volume applications.
nRF54L15 supports Bluetooth Low Energy 6.0, including Channel Sounding (supported in nRF Connect SDK v3.0.1 and later). The standard and additional Bluetooth LE features are supported, including the networking capabilities of Bluetooth Mesh with accompanying Bluetooth NLC (Networked Lighting Control) profiles, and Bluetooth PAwR (Periodic Advertising with Responses) with the ESL profile. All nRF54L wireless SoCs are multiprotocol, supporting Matter and IEEE 802.15.4-2020 based protocols, including Thread and Zigbee, which can be used together with Bluetooth LE for use cases such as secure provisioning or DFU. Ecosystems such as Amazon Sidewalk, Google Find My Device, and Apple Find My are also supported and available with the nRF Connect SDK. In addition to standardized protocols, nRF54L Series supports the implementation of proprietary 2.4 GHz protocols with the new 4 Mbps mode. Additionally, the nRF54L15 can run a Wi-Fi stack for the companion ICs from the nRF70 Series.
The nRF54L15 is available in a WLCSP package for demanding and size-constrained products.
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The STM32WL3 is based on an Arm Cortex®-M0+ core, a sub-GHz radio, and a wideband wake-up radio. It supports multiple modulation schemes and provides an IQ interface to enable custom modulation for enhanced flexibility.
The STM32WL3x is a highly integrated, long-range wireless solution for IoT devices, offering a simplified design approach and low power consumption for extended battery life.
The STM32WL3's main radio enables long-range connectivity with a receive sensitivity of up to -132 dBm and programmable transmit power up to +20 dBm, while maintaining low power consumption (10 mA at 10 dBm).
It supports a wide range of modulation schemes and includes an IQ interface for legacy protocol support. The radio complies with global regulatory standards and covers major sub-GHz ISM bands: 159–185 MHz, 413–479 MHz, and 826–958 MHz.
This platform is designed to be simple yet highly flexible, supporting multiple modulation formats such as 4-(G)FSK (up to 600 Kbps), 2-(G)FSK, (G)MSK, DBPSK, DSSS, OOK, and ASK. The built-in IQ interface also allows developers to implement custom modulation schemes for greater design freedom.
An always-on OOK wake-up radio further enables ultra-low-power operation in applications requiring continuous listening.
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The new Series 3 families of SoCs include:
SiXG301: Optimized for Line-Powered Applications
Purpose-built for line-powered smart devices, the SiXG301 includes an integrated LED pre-driver and offers an ideal solution for advanced LED smart lighting and smart home products, supporting Bluetooth, Zigbee, and Thread with support for Matter. Built with high Flash and RAM overhead of 4 MB and 512 kB, respectively, the SiXG301 helps future-proof customer designs as the requirements for Matter and other more demanding IoT applications continue to grow. This SoC enables concurrent multi-protocol operation for Zigbee, Bluetooth and Matter over Thread networks at the same time, which helps simplify manufacturing SKUs, reduce costs, save board space for additional device integrations, and improve consumer usability. Already in production with select customers, the SiXG301 is slated for general availability in Q3 2025.
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The RTL8773DO is a Bluetooth audio SoC made for smart glasses and other wearable devices. It supports Bluetooth 5.3, including BR/EDR, BLE, and LE Audio.
With low-latency performance, it can handle stereo audio, voice pickup, and broadcast audio sharing without Wi-Fi.
The chip adopts a quad-core architecture, with dual HiFi DSPs and a low-power controller, enabling real-time processing of noise reduction, voice input, and ambient sound. This helps users get clearer calls and more stable voice commands, especially when using the device outdoors or on the move.
The RTL8773DO can support features like wake-word detection and simple voice control, allowing users to operate smart glasses hands-free. Its low-power design extends battery life, which is important for compact and lightweight wearables.
The chip combines audio, voice, and control functions into one package. This helps make the hardware design simple and keeps the overall system size and cost down. It also supports LE Audio’s BIS and CIS modes, so multiple users can share audio at the same time—for example, during tours, events, or team communication.
The RTL8773DO is now being used by several ODM partners to develop smart glasses and other wearable products. It provides the functions needed for daily use, with stable performance and efficient power consumption.
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Based on 40nm process, leveraging more than a decade of Qorvo’s UWB expertise, the QM35825 includes an impressive 104 dB link budget and on-chip AI and machine learning (ML) processing to significantly enhance ranging accuracy and resilience.
This high- performance, ultra-low-power SoC enables precise location tracking with radar-based sensing for presence detection automation, secure home access, non-invasive vital sign monitoring and personalized content experiences.
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The Balletto family is a complete AI/ML microcontroller solution for connected IoT platforms with integrated Bluetooth Low Energy 5.3 and 802.15.4 wireless subsystem and a dedicated network co-processor, enabling connectivity without the need for a separate chip. Employing the same architecture as the Ensemble family, Balletto utilizes the Cortex-M55 CPU plus the Ethos-U55 neural processor for amazingly efficient Edge ML processing.
Key Benefits of B1:
1. BLE 5.3 + 802.15.4 radio subsystem
2. Ethos-U55 46 GOPs of extreme low-power on-chip AI/ML processing
3. Heavy DSP processing capability ideal for audio
4. Wide selection of camera, audio, sensor and communication interfaces
5.Precision analog measurement
6. Tiny packaging down to a WLCSP with footprint of just 3.9mm x 3.9mm
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