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Gen 4 SiC MOSFET technology platform is engineered to improve switching behaviors and design challenges commonly experienced in high-power designs. Available in the 750V, 1200V and 2300V classes, the Gen 4 charts a long-term roadmap across Wolfspeed’s power portfolio.
Gen 4 will deliver significant performance enhancements for designers of high-power automotive, industrial, and renewable energy systems.
Designed to Last, Even in the Harshest Environments
With a short-circuit withstand time of up to 2.3 µS, Gen 4 provides an additional safety margin for critical applications. Additionally, the platform offers up to 100 times improvement in cosmic ray failure-in-time (FIT) rates, compared to previous technologies, ensuring reliable performance across elevations and altitudes. The body diode design enhances system performance and durability, enabling faster switching with less losses and reduced ringing - achieving 80% reduction in VDS overshoot. Selected Gen 4 die are qualified for continuous operation at 185°C and limited life operation at 200°C, allowing the flexibility to push designs to maximum performance.
Designed to Comprehensively Improve System Efficiency
Gen 4 delivers up to a 21% reduction in specific on-resistance at operating temperature – reducing conduction losses at light load and full load. Hard switching applications will benefit from up to 15% lower switching losses. These efficiencies are complemented by Gen 4’s excellent 175 °C RDSON, reinforcing Wolfspeed’s commitment to reliable performance under real-world operating conditions.
Designed to Reduce System Cost and Development Time
The new platform enables the use of smaller, more affordable, passive and filtering components - ultimately reducing system development time and cost. Additionally, Gen 4 allows for up to 30% higher power output within the same footprint. Gen 4’s ability to integrate a new soft body diode design significantly reduces EMI during reverse recovery, streamlining the process for EMI certification and allowing for smaller EMI filters.
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Arm Zena CSS 結合了 Arm 最新的 IP 與開發工具,針對軟體定義車輛(SDV)提供最佳化的運算效能,同時兼顧安全性、資安性與 AI 應用。
Armv9-A 汽車強化型 Cortex-A 處理器
採用 Cortex-R 架構的功能安全島
採用 Cortex-M 架構的安全隔離區
具備汽車強化功能的 CMN 一致性互連與系統/電源管理 IP
可選整合 Arm Mali GPU、ISP,以及自訂 AI 加速器
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NXP Software-defined Vehicle (SDV) Platform include TTTech Auto, a part of NXP is a leading platform product and service provider with a focus on System, Safety and Security for the Software-Defined Vehicle (4SDV). With series experience from several million cars on the road and a strong technology portfolio, TTTech Auto has the key ingredients to enable and drive the transformation. TTTech Auto empowers customers to focus on driving experience while its platform solutions optimize performance, safety, integration, and software updates.
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With increasing system complexity in autonomous driving and ADAS, sensor modules require more reliable and efficient power management solutions. Richtek’s RTQ2079-QA is a functional safety-grade automotive power management IC, designed specifically for camera and mmWave radar modules. It features a patented high-speed PWM control architecture (US 11,658,650 B1) that builds a virtual high-side inductor current based on traditional detection circuits. This approach effectively reduces current distortion and suppresses PWM instability, ensuring stable output under high input voltage conditions and improving system reliability.
RTQ2079-QA integrates comprehensive safety features, including a built-in watchdog timer, voltage monitoring, and diagnostic functions—enabling compliance with ISO 26262 ASIL-B without external components. It is qualified to IATF 16949 standards, supports 24V battery input, passes Load Dump and Jump Start tests, and operates at 1.8MHz to avoid AM band interference. Its high-PSRR LDO minimizes the need for external filtering, helping reduce system cost and complexity.
The device also incorporates EMC CPM modeling to predict behavior under various EMI conditions, enabling faster platform validation for OEMs and Tier 1 suppliers. RTQ2079-QA is already in volume production with leading module manufacturers in China.
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Leads a new vehicle audio architecture
This solution is based on the new automotive EE architecture – zonal architecture. It integrates audio amplifiers into Zonal Control Unit (ZCU). Transmits Audio Data with vehicle Ethernet backbone instead of dedicated A2B bus, which could help to decrease the cost of audio part. The speakers in the car could be connected to a closest ZCU with much shorter wiring harness, which could reduce the vehicle weight and simplify the assembly. Dedicated External Audio AMP module is no more needed with this solution. Distributed audio amplifiers help the thermal management become easier while more and more speakers are integrated into a car.
Thanks to SR6Gx automotive MCU from STMicroelectronics. We could implement this new audio architecture without any extra BOM. Internal hardware modules and Ethernet TSN stacks help recover audio transmitted over Ethernet and ensure the audio synchronization between different ZCUs. It helps to implement audio over Ethernet solution with lower cost and better performance.
Demo car has been created to show this solution in a more intuitive way. This demo car has two ZCUs with 4 audio channels each. It can play the audio transmitted over Ethernet and keeps the audio synchronized between different ZCUs. Many OEMs are interested in this solution and some of them are cooperating with us for some further study about this solution.
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Ansys ConceptEV is a simulation platform that optimizes the design of your entire electric powertrain. It provides fast and accurate decision making early in the development process.
Enhance EV System Performance with Collaborative Design Space Exploration - ConceptEV empowers system and component design engineering teams to collaborate on a shared system simulation connected to requirements from the start of the design process. Connect motor, inverter, transmission, and battery designs to evaluate overall powertrain behavior and vehicle performance.
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