Edge Computing Platform-EE Awards-EE Times

Product：IP66-Certified Military-Grade Edge AI Computer

Recommended reasons：本產品具備雙重防護技術，通過MIL-STD-810H軍用防護標準及IP66防護等級認證，具備防水、防塵、防震和耐高低溫能力，適用於戶外、國防、極端產業應用。搭載AI邊緣運算平台，支援NVIDIA Jetson AGX Orin系列模組，可即時執行影像辨識、異常偵測等複雜AI運算，提升智慧安防、交通管理與自動化運作效率。專利無風扇散熱結構（專利號M565941）採用一體成型鋁擠設計，有效導散長時間高負載所產生的熱能，長效穩定且降低維護頻率與成本。寬電壓設計（9~60V DC），具備過壓、突波、過電流與短路防護，另支援BBU備援電池介面（專利號M447854），確保緊急斷電時資料持續上傳。產品並提供多種I/O擴充介面，如PoE供電乙太網路埠、10Gb網路、CAN FD、RS-232/422/485、DIO、GMSL2攝像頭與M.2模組擴充等，可彈性整合各式攝影機、感測器、資料收集與控制設備，滿足客戶現場多元應用及高度客製化需求。

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NXP Semiconductors

Product：NXP i.MX 8M Plus – Edge Computing, Machine Learning, Vision, Multimedia and Industrial IoT

Recommended reasons： NXP i.MX 8M Plus family focuses on machine learning and vision, advanced multimedia, and industrial automation with high reliability. It is built to meet the needs of Smart Home, Building, City and Industry 4.0 applications.

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Winmate Inc.

Product：Winmate 10.1-inch Rugged Robotic Controller - G101TG

Recommended reasons： The Winmate G101TG is a rugged 10.1-inch robotic controller featuring an Intel Core i5 processor, full HD PCAP touchscreen, and customizable joystick controls. Compliant with MIL-STD-810H and IP65 standards, it offers optional 4G/5G, high-brightness display, and Ubuntu OS for field flexibility.

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Alif Semiconductor

Product：New Generation of Ensemble MCU family, E4/6/8

Recommended reasons： The new E4, E6 and E8 Ensemble MCUs and fusion processors integrate the latest neural processing unit (NPU) from Arm^®, the Ethos ™ -U85, with Alif’s unique high bandwidth memory and intelligent power management architecture to support NPU operators required by transformer networks to efficiently execute generative AI workloads. Transformer networks enrich endpoint use cases by focusing on the most relevant parts of older portions of an acquired input sequence while rapidly processing in parallel the current acquired sequence to enable deeper contextualization. For localized use this results in an instant, accurate, and more satisfying experience when using multimodal AI in endpoint products focused on vision, voice, text, and sensor fusion without relying on the cloud. The new E4/6/8 family also introduce a set of improvements to give even higher AI/ML performance at lower power consumption, and to provide more integrated support for embedded vision and audio applications. New features integrates a wider internal memory bus topology bringing abundant localized data bandwidth for NPU consumption, dual MIPI-CSI camera interfaces, a fast hardware image signal processor operating up to 200 frames per second, and a pair of faster interfaces to external memory each capable of 800MBytes/s. And finally, new broader options for SRAM data retention gives designers more flexibility to wake from sleep faster.

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SINTRONES Technology Corp.

Product：IP66-Certified Military-Grade Edge AI Computer

Recommended reasons： The product features dual protection with MIL-STD-810H and IP66 certifications, providing water, dust, shock, and temperature resistance for outdoor, defense, and industrial uses. Its AI edge computing supports NVIDIA Jetson AGX Orin modules, enabling real-time image recognition and analysis, lowering bandwidth usage, and improving efficiency in smart security and automation applications. The patented fanless thermal design (Patent No. M565941) uses an integrated aluminum chassis for efficient heat dissipation during high AI workloads, ensuring stable long-term operation and reducing maintenance costs. The wide-voltage (9~60V DC) power module offers protection against surges, overcurrent, and short circuits, with BBU support (Patent No. M447854) for critical data backup during outages. It also provides flexible expansion, including PoE, 10Gb Ethernet, CAN FD, serial ports, DIO, GMSL2, and M.2 slots, streamlining integration with cameras, sensors, and communications for custom deployments.

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Nordic Semiconductor

Product：ML Studio

Recommended reasons： ML Studio is Nordic's own platform for creating embedded ML models to run on Nordic hardware. ML Studio was created in close collaboration with and is powered by Edge Impulse. It is the edge AI platform for enterprise teams building innovative products. Optimize models and deploy to any edge device with ease. Accelerate product development and minimize risks with a platform built to handle the challenges of working with real-world sensor data. It is a fully integrated end-to-end MLOps platform with powerful automations and low-code capabilities to make it easier to build valuable datasets and develop advanced ML. It is the first ML platform that allows users to tune DSP along with ML. Edge Impulse also has the largest hardware ecosystem, allowing our customers to seamlessly deploy on any real-world product. Raw data can be collected from accelerators, microphones, and other sensors and sent to ML Studio using the Nordic’s data forwarder tool. This allows the platform to obtain datasets, then train and install models. With these readily available development tools, non-experts can quickly access tinyML software for a wide range of IoT end-devices. The platform currently offers full support for Nordic’s nRF52840, nRF5340 and nRF9160 dev kits and for the Thingy:53 and Thingy:91. Developers can achieve all these through the platform: • Edge Impulse integration in nRF Connect SDK • nRF Edge Impulse App in combination with Thingy:53: • EdgeImpulse documentation for Thingy:53 • Edge Impulse samples in nRF Connect SDK • nRF Machine Learning application in nRF Connect SDK

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Silicon Labs

Product：BG24L Bluetooth LE SoC with AI/ML Accelerator

Recommended reasons： Where the BG24L really sets itself apart is in its AI/ML capabilities. With the built-in Matrix Vector Processor (MVP) enables on-device inferencing up to 8x faster and at 1/6th the power compared to CPU-only processing. That unlocks a whole range of applications where real-time data from sensors is used to detect patterns, learn over time, and trigger events without needing to stay connected to the cloud. This makes the BG24L an excellent fit for predictive maintenance, anomaly detection, and condition monitoring in industrial or agricultural settings. For example, sensors placed on a motor can continuously track temperature and vibration. If those values drift outside normal patterns, the device can flag it as a potential early failure, helping prevent downtime and extending the life of the equipment. The BG24L was built specifically for sensor-driven, ML-capable devices. Flash and RAM are optimized for this class of applications, and if your ML use case demands more, Silicon Labs has other SoCs ready for that. But when it comes to edge inferencing on real-time sensor data, BG24L ultra-low power Bluetooth SoC hits the sweet spot—smart, efficient, and ready to deploy.

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STMicroelectronics

Product：STM32+AI control Robotic hand solution

Recommended reasons： Gesture Recognition and Control System Based on STM32N6 and STM32MP257 This system, built on the STM32N6 and STM32MP257 platforms, implements a gesture recognition and control system. It captures hand gesture data in real-time via a camera. The STM32N6 leverages its integrated NPU to accelerate the MediaPipe deep learning model, extracting the coordinates of 21 hand keypoints at a rate of 30fps. These coordinates are transmitted to a Programmable Logic Controller (PLC) via an RS-485 bus. The dual-core STM32MP257 PLC, operating on the CODESYS platform support multiple communication protocols, and performs joint angle calculations. It converts the received coordinates into robotic hand control commands, driving the RuiYan RY-H1 robotic hand via the CAN protocol. This robotic hand employs a 15-degree-of-freedom linear actuation design, control by 5 pieces STM32G4. Integrated with a force-position hybrid algorithm, it achieves biomimetic motion and enables adaptive grasping without requiring force sensors. The system integrates ST's X-CUBE-AI model deployment capabilities and supports industrial communication protocols (EtherCAT/Modbus). Operating under a heterogeneous computing architecture, it achieves a millisecond-level closed-loop from gesture recognition to mechanical execution. This solution is suitable for industrial applications such as automated assembly and intelligent grasping, featuring both high precision and strong real-time performance.

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AMD

Product：AMD Spartan™ UltraScale+™ FPGAs

Recommended reasons： AMD Spartan™ UltraScale+™ FPGA product family is designed for cost-sensitive edge applications, providing high I/O count, outstanding power efficiency, cost-effectiveness, and state-of-the-art modern security features for a variety of I/O-intensive applications at the edge, such as embedded vision, medical, industrial networking, robotics, and video applications. It delivers the industry's highest I/O-to-logic cell ratio in FPGAs based on 28nm and lower process technologies, delivers up to 30% lower total power consumption versus the previous generation, and contains the most robust set of security features in the AMD Cost-Optimized Portfolio. Spartan UltraScale+ FPGAs are optimized for edge computing, delivering high I/O counts and flexible interfaces which allow the FPGAs to seamlessly integrate and efficiently interface with multiple devices or systems to address the explosion of sensors and connected devices. The family offers the industry’s highest I/O to logic cell ratio of FPGAs built on 28nm and below process technology, with up to 572 I/Os and voltage support up to 3.3V, enabling any-to-any connectivity for edge sensing and control applications. The proven 16nm fabric and support for a wide array of packaging, starting as small as 10x10mm, provide high I/O density in an ultra-compact footprint. The extensive AMD FPGA portfolio also provides the scalability to start with cost-optimized FPGAs and continue through to midrange and high-end products. The octal SPI interface supports faster configuration and data transfer rates from external flash memory. The Spartan UltraScale+ family is estimated to offer up to a 30% reduction in power compared to the 28nm Artix™ 7 family, through 16nm FinFET technology and hardened connectivity. They are the first AMD UltraScale+ FPGAs with a hardened LPDDR5 memory controller and PCIe^® Gen4 x8 support, providing both power efficiency and future-ready capabilities for customers.

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YUAN High-Tech Development Co., Ltd.

Product：AIR6N0 Edge AI Vision Platform

Recommended reasons： YUAN AIR6N0 system, powered by the NVIDIA^® Jetson Orin™ NX Super module, delivers up to 157 TOPS of AI computing power, redefining the standard for compact and lightweight AI platforms. ➤ Compact and High-Efficiency AI Platform Design Through an innovative dual-board architecture, it integrates powerful computing capabilities into a business card-sized carrier, achieving an ultra-compact, low-power embedded platform. A fanless version is also available for outdoor and industrial environments, enhancing system reliability under harsh conditions. ➤ Modular Stackable Architecture with Flexible I/O Expansion AIR6N0 adopts a stackable modular design, allowing users to freely configure I/O expansion boards based on application needs. The platform natively supports HDMI 2.1, 12G-SDI, GMSL2, and other high-bandwidth video interfaces, and also offers customized expansion board design services to flexibly adjust communication and power interfaces for diverse deployment scenarios such as automotive, UAVs, and smart transportation. ➤ Powerful AI Processing and Versatile Application Support With YUAN’s self-developed NexVDO SDK and VPP AI model suite, AIR6N0 supports multi-channel 4K60 AI processing. It integrates a hardware ISP and a high-bandwidth DMA PCIe capture architecture, delivering RGB 4:4:4 image quality. The system also combines low-latency RDMA capture, H.26X/AV1 encoding/decoding, and SkyLink X streaming technology, enabling ultra-low latency performance under 50ms—ideal for real-time monitoring, edge AI inference, and generative AI workloads.

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Liscotech System Co. Ltd.

Product：CubeSat GPGPU Space AI Edge Computing module

Recommended reasons： The GP2U100 series is a robust CubeSat computing module built with the Nvidia Jetson Orin series, delivering up to 70 TOPs of computing power. It features a custom-designed carrier board by Liscotech, equipped with eFuse, protection circuits, and a rich array of I/O options, including serial ports, Ethernet, CAN, SPI, and GPIO.

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