We have invented a disruptive technology that can REFORM the entire ecosystem of power semiconductor devices, addressing the long-standing issue of traditional packaging – dilemma between high-power delivery and efficient heat dissipation.

By adopting Fan-Out Panel Level Packaging (FOPLP) technology, the highly integrated power module (industry pioneer) uses top-side cooling combined with extremely low thermal resistance, achieving excellent heat dissipation capability in an ultra-small package.

Bespoke Battery Protection MOSFET module with ground-breaking design, massively reduce overall size and elimination of bulky heat dissipation structures.