ML100 IO Die is an interconnect Chiplet solution that MSquare Technology developed specifically for AI SoC architectures, featuring the integration of the advanced UCIe protocol and HBM3 technologies. The product integrates 16 UCIe modules compliant with the UCIe 1.1 specification, each capable of delivering up to 1 TB/s of bandwidth. These UCIe interfaces support the AXI4.0 standard, enabling high-bandwidth, low-latency data connections between chips.

To support high-speed memory access, ML100 integrates a full HBM3 IP solution including the controller and PHY, compliant with the JESD238 standard and supporting IO speeds of up to 6400 Mbps. The product adopts advanced 2.5D packaging technology, enabling effective decoupling between the HBM and SoC. This design improves thermal performance, reduces system power consumption, while optimizing chip area and manufacturing cost.

As a high-performance interconnect Chiplet solution featuring high bandwidth, fast data transmission, and low power consumption, ML100 IO Die is well suited for AI training and high-performance computing applications. It is engineered to meet the rigorous demands of modern heterogeneous computing systems, where bandwidth, latency, and system efficiency are critical.