RF/ Wireless IC-EE Awards-EE Times

Product：A6133M4 5.8GHz Wireless SoC

Recommended reasons： A6133M4 is a high performance and low cost 5.8GHz SoC. It integrates M4F micro controller, 512KBytes flash memory, 80KBytes SRAM, USB 2.0 compatible controller and various powerful functions. A6133M4 supports fast PLL settling time for frequency hopping system. For packet handling, A6133M4 has built-in separated 1K Bytes TX/RX FIFO for data buffering and burst transmission, auto-ack and auto-resend, CRC for error packet filtering, FEC (7,4 hamming code) for 1-bit data correction per code word, RSSI for clear channel assessment, thermal sensor to monitor relative temperature, data whitening for data encryption / decryption. In addition, A6133M4 has built-in AES128 co-processor (Advanced Encryption Standard) for advanced data encryption or decryption which consists of the transformation of a 128-bit block into an encrypted 128-bit block. Those functions are very easy to use while developing a wireless system. All features are integrated in a QFN7x7 56 pins package.

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Nordic Semiconductor

Product：nRF54L15 Ultra-low-power wireless SoC

Recommended reasons： nRF54L15 wireless SoC integrates an ultra-low-power multiprotocol 2.4 GHz radio and MCU (Microcontroller Unit) functionality, featuring a 128 MHz Arm Cortex-M33 processor and comprehensive peripheral set. The series offers a selection of packages and memory size options with pin-to-pin compatible QFN packages. nRF54L15 is suitable for products using Bluetooth Low Energy, Bluetooth Mesh, Zigbee, Thread, Matter, Amazon Sidewalk, and proprietary 2.4 GHz protocols. In addition, it can run a Wi-Fi stack for the nRF70 Series companion ICs. nRF54L15 is the largest memory option in the nRF54L Series, with 1.5 MB NVM and 256 KB RAM, for more demanding applications, while still being cost-optimized for high-volume applications. nRF54L15 supports Bluetooth Low Energy 6.0, including Channel Sounding (supported in nRF Connect SDK v3.0.1 and later). The standard and additional Bluetooth LE features are supported, including the networking capabilities of Bluetooth Mesh with accompanying Bluetooth NLC (Networked Lighting Control) profiles, and Bluetooth PAwR (Periodic Advertising with Responses) with the ESL profile. All nRF54L wireless SoCs are multiprotocol, supporting Matter and IEEE 802.15.4-2020 based protocols, including Thread and Zigbee, which can be used together with Bluetooth LE for use cases such as secure provisioning or DFU. Ecosystems such as Amazon Sidewalk, Google Find My Device, and Apple Find My are also supported and available with the nRF Connect SDK. In addition to standardized protocols, nRF54L Series supports the implementation of proprietary 2.4 GHz protocols with the new 4 Mbps mode. Additionally, the nRF54L15 can run a Wi-Fi stack for the companion ICs from the nRF70 Series. The nRF54L15 is available in a WLCSP package for demanding and size-constrained products.

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STMicroelectronics

Product：ST60A3H1

Recommended reasons： The ST60A3H1 is a 60 Ghz transceiver with dual-linear polarization antenna integrated in the package. The Antenna in Package make it easier for designer to design in this 60Ghz transceiver into their product without much RF expertise. It is compliant with eUSB2, UART and I2C protocols and supportse USB2, UART and I2C RF tunneling. Its data rate can be up to 480 Mbps. It is BOM optimized with no external matching network and clock reference. ST60 is ideal for application that requires contactless, point to point and high speed wireless data transfer like firmware update of waterproof products without any connectors.

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NXP Semiconductors

Product：IW610 (Wi-Fi 6/BLE/802.15.4)

Recommended reasons： The IW610 Family features a 1x1 Dual-band (2.4 GHz / 5 GHz) Wi-Fi 6 radio subsystem, offering improved network efficiency, reduced latency and extended range compared to previous Wi-Fi standards. Its Bluetooth LE radio supports a high-speed data rate of 2 Mbit/s, along with long-range communication and extended advertising for network commissioning and sensor aggregation. The IW610 Family supports both dual and single-antenna configurations, ensuring efficient coexistence between internal and external radios.

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Silicon Labs

Product：SiXG301 Wireless SoC at the Advanced 22 nm Process Node

Recommended reasons： The new Series 3 families of SoCs include: SiXG301: Optimized for Line-Powered Applications Purpose-built for line-powered smart devices, the SiXG301 includes an integrated LED pre-driver and offers an ideal solution for advanced LED smart lighting and smart home products, supporting Bluetooth, Zigbee, and Thread with support for Matter. Built with high Flash and RAM overhead of 4 MB and 512 kB, respectively, the SiXG301 helps future-proof customer designs as the requirements for Matter and other more demanding IoT applications continue to grow. This SoC enables concurrent multi-protocol operation for Zigbee, Bluetooth and Matter over Thread networks at the same time, which helps simplify manufacturing SKUs, reduce costs, save board space for additional device integrations, and improve consumer usability. Already in production with select customers, the SiXG301 is slated for general availability in Q3 2025.

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Realtek Semiconductor Corporation

Product：RTL8773DO BT Audio SoC for Smart Wearables

Recommended reasons： The RTL8773DO is a Bluetooth audio SoC made for smart glasses and other wearable devices. It supports Bluetooth 5.3, including BR/EDR, BLE, and LE Audio. With low-latency performance, it can handle stereo audio, voice pickup, and broadcast audio sharing without Wi-Fi. The chip adopts a quad-core architecture, with dual HiFi DSPs and a low-power controller, enabling real-time processing of noise reduction, voice input, and ambient sound. This helps users get clearer calls and more stable voice commands, especially when using the device outdoors or on the move. The RTL8773DO can support features like wake-word detection and simple voice control, allowing users to operate smart glasses hands-free. Its low-power design extends battery life, which is important for compact and lightweight wearables. The chip combines audio, voice, and control functions into one package. This helps make the hardware design simple and keeps the overall system size and cost down. It also supports LE Audio’s BIS and CIS modes, so multiple users can share audio at the same time—for example, during tours, events, or team communication. The RTL8773DO is now being used by several ODM partners to develop smart glasses and other wearable products. It provides the functions needed for daily use, with stable performance and efficient power consumption.

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Qorvo, Inc.

Product：QM35825, fully integrated, low-power UWB SoC

Recommended reasons： Based on 40nm process, leveraging more than a decade of Qorvo’s UWB expertise, the QM35825 includes an impressive 104 dB link budget and on-chip AI and machine learning (ML) processing to significantly enhance ranging accuracy and resilience. This high- performance, ultra-low-power SoC enables precise location tracking with radar-based sensing for presence detection automation, secure home access, non-invasive vital sign monitoring and personalized content experiences.

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Morse Micro

Product：Morse Micro MM8108 Wi-Fi HaLow SoC & USB Reference Platform

Recommended reasons： The MM8108 from Morse Micro is a breakthrough in AIoT and embedded connectivity—designed to meet the extreme demands of next-generation, intelligent edge devices. As the world’s smallest, fastest, and lowest-power Wi-Fi HaLow chip, it delivers unprecedented range, throughput, and power efficiency in the sub-GHz band, solving the toughest connectivity challenges in industrial, city-scale, and remote environments. What sets the MM8108 apart is its advanced 256-QAM modulation at 8 MHz bandwidth, delivering up to 43.33 Mbps—far exceeding alternatives like LoRa or Zigbee. Its integrated 26dBm PA and 325mA ultra-low current draw eliminate the need for external components, reduce design complexity, and support global certifications. This enables solar- or battery-powered operation for AI-enabled smart cameras, sensors, and embedded devices, bringing scalable intelligence to the far edge. Morse Micro’s MM8108 USB dongle and evaluation kit accelerates adoption by offering plug-and-play Wi-Fi HaLow for existing Wi-Fi infrastructures. This opens the door to deployable, standards-based connectivity that is secure (WPA3), efficient, and IoT-native (IPv6-ready). These features are critical for powering embedded AI workloads—whether for smart meters, predictive maintenance, wildlife monitoring, or autonomous logistics. In essence, the MM8108 redefines what’s possible in embedded connectivity, creating a vital platform for intelligent, secure, and energy-efficient systems that operate reliably at the outermost edges of the network—where traditional Wi-Fi fails.

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Alif Semiconductor

Product：Balletto B1 BLE 5.3 MCU for Edge AI

Recommended reasons： The Balletto family is a complete AI/ML microcontroller solution for connected IoT platforms with integrated Bluetooth Low Energy 5.3 and 802.15.4 wireless subsystem and a dedicated network co-processor, enabling connectivity without the need for a separate chip. Employing the same architecture as the Ensemble family, Balletto utilizes the Cortex-M55 CPU plus the Ethos-U55 neural processor for amazingly efficient Edge ML processing. Key Benefits of B1: 1. BLE 5.3 + 802.15.4 radio subsystem 2. Ethos-U55 46 GOPs of extreme low-power on-chip AI/ML processing 3. Heavy DSP processing capability ideal for audio 4. Wide selection of camera, audio, sensor and communication interfaces 5. Precision analog measurement 6. Tiny packaging down to a WLCSP with footprint of just 3.9mm x 3.9mm

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STMicroelectronics

Product：ST25R300

Recommended reasons： ST25R300 High-performance NFC reader offers extended range and outstanding robustness The ST25R300 offers significantly higher power output (up to 2.2W) and extended range capabilities, allowing designers the freedom to use compact antenna components. The device’s high output power also provides outstanding receiver sensitivity and reliability in electrically noisy environments, such as payment or access-control applications when the reader’s antenna is located behind an LCD screen or metal casing. In addition to outstanding performance and extended wakeup range, the ST25R300 offers all the advanced features that have made the ST25R series the preferred choice for designers of NFC applications including EMVCo payments, access control, Qi protection, NFC charging and product traceability

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Faraconix Technology Co., Ltd.

Product：Phase8 L-PAMiD

Recommended reasons： Faraconix Technology has achieved innovative breakthroughs in communication frequency, band number, channel bandwidth and carrier aggregation by using CuPAM and 5G millimeter-wave frequency conversion technologies. Based on these, it launched China's first high-integration RF front-end module Phase8 L-PAMiD (FCX62985). The product integrates RF switches, filters, duplexers, quadplexers and controllers in a 6.8×8.65mm SiP package, supporting NR/LTE/UMTS/CDMA/GSM and low-frequency bands below 3GHz (e.g., B(n)8, 26, 28). With 3.4V high-power output, it meets market demand for efficient low-power RF modules. Compared with Phase7L/LE, its area is reduced by 42%, more competitive in space-constrained mobile terminals. This cost advantage helps Faraconix excel in price competition and offer higher-cost-performance products.

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