MCU/ Driver IC-EE Awards-EE Times

Product：STM32U3 Ultra Low Power Microcontroller

Recommended reasons： The STM32U3 extends battery life and enhances data protection in industrial, medical, and consumer devices that require strict power and cost efficiency. It is the first STM32 built on a near-threshold design, which drastically reduces the dynamic power consumption of the end application. Based on an Arm^® Cortex^®-M33 core and equipped with extended memory — 256 Kbytes of RAM and 1 Mbyte of dual-bank Flash — the STM32U3 leads the market in efficiency, achieving 117 CoreMark/mW and a static current below 2 µA. Built on 40 nm platform with Near-threshold design drastically reducing dynamic consumption. Integrating essential peripherals: I3C (new and updated IP allowing efficient data transfer, real-time event handling, error detection) and FDCAN IP (low-latency communication, large data transfer)

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inergy Technology Inc.

Product：iU6398 Code-Free FOC Highly Integrated BLDC Motor Controller with Pre-Driver

Recommended reasons： The iU6398 is a highly integrated, code-free FOC motor control product designed to simplify BLDC motor control design. It integrates a motor controller, a three-phase gate driver (supporting up to 160V N/N MOSFETs), a high-voltage Buck controller, and a 5V LDO into a compact QFN32 4x4 package. It suitable for 12V to 80V systems. It supports both sensor-less and sensor-based BLDC motor control configurations. The device provides a cost-effective and highly reliable sensor-less control solution with a minimal footprint, while also enabling efficient handling of sensor inputs for enhanced startup performance and accurate position feedback. With its high integration and robust performance, the iU6398 is perfect for precision control applications requiring high efficiency and stability, such as AI servers, high-performance computing (HPC), and industrial equipment. High Integration: Combines multiple critical components to significantly simplify peripheral circuit design. Code-Free Development: Built-in inergy Drive algorithm supports advanced FOC (Field-Oriented Control). Comprehensive Protection Mechanisms: Equipped with Over-Voltage Protection (OVP), Over-Current Protection (OCP), Current Limiting, Over-Temperature Protection (OTP), and Auto Recovery. The mechanisms enhance system reliability and stability. Safe Driving Features: #Shoot-through Prevention & Dead Time Circuitry #Built-in Under-Voltage Lockout (UVLO) Power Management: #Built-in HV-Buck Controller #Built-in 5V LDO Advanced FOC Technology: #High Efficiency Operation: Precisely controls magnetic flux and torque, achieving optimal efficiency under various speeds and load conditions. #Precision and Stability: Enables accurate speed and torque control with fast response to load changes, maintaining system stability. #Wide Speed Range: Maintains stable, efficient operation from ultra-low to high speeds for flexible motor control. #Automatic Load Adaptation: Combines sensor data and algorithms to intelligently adapt to load changes, optimizing energy efficiency.

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Texas Instruments

Product：MSPM0C1104 small-size 24MHz Arm^® Cortex^®-M0+ MCU

Recommended reasons： The MSPM0C1104 MCU leverages the advantages of WCSP packaging technology, along with intentional feature selection and TI's cost optimization efforts. The size of the eight-ball WCSP is 1.38mm2, making it 38% smaller than competing devices. The MCU features 16KB of memory; a 12-bit analog-to-digital converter with three channels; six general-purpose input/output pins; and compatibility with standard communication interfaces such as Universal Asynchronous Receiver Transmitter (UART), Serial Peripheral Interface (SPI) and Inter-Integrated Circuit (I2C). Integrating accurate, high-speed analog components into the world's smallest MCU gives engineers the flexibility to maintain the computing performance of their embedded systems without increasing board size. The new MSPM0C1104 joins TI's MSPM0 MCU portfolio, which offers scalability, cost optimization and ease of use to accelerate time to market. TI's MSPM0 MCUs feature pin-to-pin compatible package options and feature sets to match memory, analog and computing requirements in personal electronics, industrial and automotive applications.

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WIZnet H.K. Limited

Product：W55MH32

Recommended reasons： The WIZnet W55MH32 is a high-performance Internet MCU that uniquely integrates WIZnet’s proven hardwired TCP/IP technology, delivering a stable and dependable networking experience essential for today’s connected applications. Unlike software-based stacks that consume host CPU resources, the W55MH32 features a TCP/IP offload engine (TOE) implemented directly in hardware, which handles networking protocols autonomously. This hardware-based design not only improves communication reliability but also frees up valuable MCU processing power, allowing developers to optimize application logic with fewer complications. This chip is powered by a high-speed ARM Cortex-M3 core (up to 216 MHz), along with 1 MB Flash and 96 KB SRAM, the W55MH32 provides strong computing capabilities for edge-level applications. Its extensive peripheral options—including USB, CAN, SDIO, ADC/DAC, and multiple UART/SPI/I2C interfaces—offer versatile integration for embedded designs. With support for up to 8 simultaneous hardware socket connections, the W55MH32 efficiently manages multiple communication streams in real time. It also includes 32 KB of dedicated Ethernet buffer memory and a built-in 10/100 Mbps MAC+PHY, enabling high-speed and consistent data transmission across a wide range of applications, from smart energy systems to industrial automation and security terminals . Security is a foundational element. The W55MH32 is equipped with a true random number generator and a comprehensive hardware algorithm suite, supporting standards like DES, AES, SHA, and China’s SM1–SM7. These features enable secure and tamper-resistant communication, protecting both transmitted data and the device itself from external threats. By handling cryptography in hardware, the device significantly reduces attack surfaces compared to software-based solutions.The built-in Memory Protection Unit (MPU) prevents third parties from accessing or tampering with source code, further enhancing system security. In summary, the W55MH32 combines hardware-accelerated networking, embedded encryption, and true random number generation to provide a highly reliable, secure, and efficient platform for next-generation connected systems.

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Nuvoton Technology Corporation

Product：NuMicro^® M2354 Series – IoT Security MCU with Chip-Level Physical Security, Ultra-low Power Performance, and Complies with International Mainstream IoT Security Standards

Recommended reasons： 1. Secure Boot with DICE: Secure Boot with DICE implemented in Mask ROM establishes a hardware Root of Trust using ECC P-521, ensuring that the entire boot process is cryptographically verified and protected from unauthorized modification. 2. NuSMP 2.0 Integration: With NuSMP 2.0 integrated, the platform delivers a comprehensive security framework that is fully compliant with PSA Level 3 and SESIP Level 3 certifications, aligns with the EU Cyber Resilience Act (CRA), and enables robust protection against both physical and logical attacks throughout the system lifecycle. 3. Ultra-Low Power Consumption: Consumes only 89.3 μA/MHz in LDO mode and 39.6 μA/MHz in DC-DC mode. The Standby Power-Down mode consumes less than 2 μA while Deep Power-Down mode consumes just 0.5 μA with VBAT and can drop as low as 0.1 μA without VBAT. These optimizations significantly extend battery life and meet the demands of long-term IoT operation. 4. Compact Footprint: Offers WLCSP49 small package option, providing cost-effective Root of Trust (RoT) with compact footprint. Ideal for space-constrained applications. 5. Comprehensive crypto accelerators: Supports standard cryptographic functions including FIPS PUB 197/180/180-2/180-4 and NIST SP 800-38A, ensuring secure and efficient hardware acceleration.

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Shanghai Bright Power Semiconductor Co., Ltd.

Product：Integrated Motor Driver IC: LKS32TW279FLN2K6Q8C

Recommended reasons： The LKS32TW279FLN2K6Q8C is a highly integrated motor drive IC, which integrates 32-bit Cortex-M0 core, a 100V DC-DC synchronous rectification buck module and a 200V three-phrase full-bridge bootstrap gate drive module in a QFN 4*4 package. It has an industrial-grade operating temperature range of -40℃ to 105℃. The switching frequency of the Buck module can be set by external resistors, with a range of 00KHz to 800KHz. It has a wide input voltage range of 5.5V ~ 80V (100V max). The pre-drive module has a built-in zero-crossing detection voltage divider resistor, reducing peripheral components. The LKS32TW279FLN2K6Q8C can be applied in AI servers, cooling fans of communication system and water pump. Due to its high integration, simple control circuit and small product size, The chip is suitable for 4cm 48V/54V server cooling fans. The components can be completely placed on the “donut” PCB with an outer diameter of 25mm and an inner diameter of 11mm. The pre-drive source/sink drive current is 1A, with strong MOSFET driving capability, which can be used in high-power equipment (>500W).

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Alif Semiconductor

Product：Ensemble New Generation EdgeAI MCU with Cortex-M55 and Ethos-U85

Recommended reasons： The new E4, E6 and E8 Ensemble MCUs and fusion processors integrate the latest neural processing unit (NPU) from Arm^®, the Ethos ™ -U85, with Alif's unique high bandwidth memory and intelligent power management architecture to support NPU operators required by transformer networks to efficiently execute generative AI workloads. Transformer networks enrich endpoint use cases by focusing on the most relevant parts of older portions of an acquired input sequence while rapidly processing in parallel the current acquired sequence to enable deeper contextualization. For localized use this results in an instant, accurate, and more satisfying experience when using multimodal AI in endpoint products focused on vision, voice, text, and sensor fusion without relying on the cloud. The new family introduces a set of improvements to give even higher AI/ML performance at lower power consumption, and to provide more integrated support for embedded vision and audio applications. New features integrates a wider internal memory bus topology bringing abundant localized data bandwidth for NPU consumption, dual MIPI-CSI camera interfaces, a fast hardware image signal processor operating up to 200 frames per second, and a pair of faster interfaces to external memory each capable of 800MBytes/s. And finally, new broader options for SRAM data retention gives designers more flexibility to wake from sleep faster.

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NXP Semiconductors

Product：NXP i.MXRT700 Crossover MCU

Recommended reasons： NXP i.MX RT700 features up to five computing cores designed to power smart AI-enabled edge devices such as wearables, consumer medical, smart home and HMI devices. Its Compute Subsystem includes a primary Arm^® Cortex^®-M33 running at 325 MHz and Cadence^® Tensilica^® HiFi 4 DSP for more DSP and audio processing. An ultra-low power Sense Subsystem includes a second Arm Cortex-M33 and Cadence Tensilica HiFi 1 DSP. This removes the need for an external sensor hub reducing system design complexity, footprint and BOM costs. i.MX RT700 includes NXP's eIQ^® Neutron NPU accelerating AI workloads by up to 172x and integrates up to 7.5 MB of onboard SRAM.

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